Mandatory Heterogeneous 3D Photonic Stacking for Computational Utility

The physical scaling limits inherent to planar Complementary Metal-Oxide-Semiconductor (CMOS) interconnects have established a fundamental architectural constraint on computational density and operational efficiency. Traditional electrical signal transmission, particularly at the high clock speeds required by advanced processing units, results in prohibitive power dissipation and resistance loss across inter-die wiring layers—a limiting condition known as the 'interconnect bottleneck.' To maintain the trajectory of exponential computing utility, a radical departure from planar architectures has become an industrial mandate: the integration of diverse functional layers into a single package substrate via active light transmission. This process is termed Mandatory Heterogeneous 3D Photonic Stacking (M-HPS).